CAPABILITIES

Capabilities

From tool design to mass production - four core technologies, one-stop integration

Core Technologies

Continuous Deep-Draw Stamping

Multi-stage deep-draw forming in progressive dies. Excels at high depth-to-diameter ratio complex geometries with a single toolset.

Fine Shaving (Fine Blanking)

Single-stroke stamping achieving near-net-shape edge quality on functional surfaces, eliminating the need for secondary grinding or machining.

Cold Forging

Work hardening to achieve ultra-high strength and fatigue resistance, ideal for structural and safety-critical parts.

Transfer Die Systems

Multi-station transfer dies for large complex parts. ASAHI-SEIKI transfer presses, covering 25T to 800T.

Press Equipment

25T–800T
Press Tonnage Range
70
Press Lines
AIDA / SEYI / YANGLI / JH21
Press Brands
0.10–8.00mm
Material Thickness Range

Tooling & Engineering

  • 100% in-house tool design and manufacturing
  • SEIBU Wire EDM (Japan)
  • CNC Machining Centers (MAZAK & TAIKAN)
  • MAZAK CNC Lathes + TSUGAMI CNC Lathes
  • Precision Grinders, Milling, Sawing and Radial Drilling
  • High-precision CNC Cylindrical Grinder

Secondary & Finishing

  • Precision tapping and threading
  • Resistance and laser welding
  • Sub-assembly and component assembly
  • Hydrocarbon degreasing + high-cleanliness aqueous washing (meets metal particle <=300um standards)
  • Double-Disc Grinding + Vibratory Deburring
  • Anti-rust treatment and custom packaging

Production Process

01

RFQ & Feasibility

02

Tool Design

03

Tool Manufacturing

04

Sample & PPAP

05

Trial Production

06

Mass Production

MATERIAL MATRIX

Material × Process Compatibility

● Full Production ◐ Capable ○ N/A

CRS

0.3–3.2mm

SPCC/SPCD/SPCE

DDFBProg

Housings, brackets

Stainless

0.3–3.0mm

SUS304/316/430

DDProg

Corrosion-resistant

Aluminum

0.5–4.0mm

A5052/6061/1050

StampCF

Lightweight

Copper

0.3–2.0mm

C1100/2680/5210

DDProg

Conductive, spring

HSS

0.8–8.0mm

SAPH440/DP600/42CrMo4

FBCFProg

Chassis, safety

Galvanized

0.3–2.5mm

SGCC/SECC/DX51D+Z

DDProg

Appliance, general